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Chemical content 74HC123BQ

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Type numberPackagePackage descriptionTotal product weight
74HC123BQSOT763-1DHVQFN1622.09612 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352824531151712601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29363
PolymerResin systemProprietary0.0161219.900000.07295
subTotal0.08100100.000000.36658
DieDoped siliconSilicon (Si)7440-21-30.41898100.000001.89617
subTotal0.41898100.000001.89617
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.44404
Iron (Fe)7439-89-60.237082.320001.07295
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03700
Zinc (Zn)7440-66-60.012260.120000.05550
Gold alloyGold (Au)7440-57-50.003060.029970.01386
Silver (Ag)7440-22-40.002040.019980.00924
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02310
Nickel (Ni)7440-02-00.130671.278720.59138
subTotal10.21900100.0000046.24789
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49055
FillerSilica -amorphous-7631-86-90.395003.490001.78764
Silica fused60676-86-09.5999384.8200043.44621
PigmentCarbon black1333-86-40.018110.160000.08195
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55319
Epoxy resin systemProprietary0.179961.590000.81442
Phenolic resinProprietary0.254662.250001.15249
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.89520
subTotal11.31800100.0000051.22165
WirePure metalCopper (Cu)7440-50-80.0571096.550000.25842
Pure metal layerGold (Au)7440-57-50.000210.350000.00094
Palladium (Pd)7440-05-30.001833.100000.00830
subTotal0.05914100.000000.26766
total22.09612100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.