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Chemical content 74HC132BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC132BQ-Q100SOT762-1DHVQFN1418.17359 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356905791151012601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10252
PolymerResin systemProprietary0.0046319.900000.02547
subTotal0.02326100.000000.12799
DieDoped siliconSilicon (Si)7440-21-30.19791100.000001.08900
subTotal0.19791100.000001.08900
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.11270
Iron (Fe)7439-89-60.166072.400000.91382
Phosphorus (P)7723-14-00.002080.030000.01142
Zinc (Zn)7440-66-60.006920.100000.03808
subTotal6.91978100.0000038.07602
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.68449
FillerSilica -amorphous-7631-86-90.367153.490002.02023
Silica fused60676-86-08.9230784.8200049.09912
PigmentCarbon black1333-86-40.016830.160000.09262
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62517
Epoxy resin systemProprietary0.167271.590000.92039
Phenolic resinProprietary0.236702.250001.30244
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14179
subTotal10.52001100.0000057.88625
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07617
Nickel (Ni)7440-02-00.4258792.300002.34336
Palladium (Pd)7440-05-30.014303.100000.07870
Silver (Ag)7440-22-40.007381.600000.04062
subTotal0.46140100.000002.53885
WirePure metalCopper (Cu)7440-50-80.0494796.550000.27219
Pure metal layerGold (Au)7440-57-50.000180.350000.00099
Palladium (Pd)7440-05-30.001593.100000.00874
subTotal0.05123100.000000.28192
total18.17359100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.