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Chemical content 74HC138BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC138BQ-Q100SOT763-1DHVQFN1621.30652 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93529874211510126030 s123520 s3Bangkok, Thailand; Suzhou, China; Jiangyin, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00468
FillerSilver (Ag)7440-22-40.0747675.000000.35088
PolymerAcrylic resinProprietary0.005986.000000.02807
Resin systemProprietary0.0179418.000000.08421
subTotal0.09968100.000000.46784
DieDoped siliconSilicon (Si)7440-21-30.24383100.000001.14441
subTotal0.24383100.000001.14441
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0434197.4700037.75093
Iron (Fe)7439-89-60.198052.400000.92954
Phosphorus (P)7723-14-00.002480.030000.01162
Zinc (Zn)7440-66-60.008250.100000.03873
subTotal8.25219100.0000038.73082
Mould CompoundAdditiveNon hazardousProprietary0.371162.984001.74202
FillerSilica -amorphous-7631-86-90.434103.490002.03742
Silica fused60676-86-010.5503184.8200049.51682
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.124631.002000.58495
PigmentCarbon black1333-86-40.020400.164000.09574
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.460353.701002.16060
Epoxy resin systemProprietary0.197271.586000.92589
Phenolic resinProprietary0.280242.253001.31527
subTotal12.43847100.0000058.37871
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00983
Nickel (Ni)7440-02-00.1906491.000000.89473
Palladium (Pd)7440-05-30.016768.000000.07866
subTotal0.20949100.000000.98322
WirePure metalCopper (Cu)7440-50-80.0606896.550000.28481
Pure metal layerGold (Au)7440-57-50.000220.350000.00103
Palladium (Pd)7440-05-30.001953.100000.00914
subTotal0.06285100.000000.29498
total21.30652100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.