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Chemical content 74HC138BQ

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Type numberPackagePackage descriptionTotal product weight
74HC138BQSOT763-1DHVQFN1621.92554 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352737781151712601235Nijmegen, Netherlands; Hsin-chu, Taiwan; Suzhou, China; Shanghai, China; Jiangyin, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29592
PolymerResin systemProprietary0.0161219.900000.07352
subTotal0.08100100.000000.36944
DieDoped siliconSilicon (Si)7440-21-30.24383100.000001.11210
subTotal0.24383100.000001.11210
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.78981
Iron (Fe)7439-89-60.237082.320001.08130
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03729
Zinc (Zn)7440-66-60.012260.120000.05593
Gold alloyGold (Au)7440-57-50.003060.029970.01397
Silver (Ag)7440-22-40.002040.019980.00931
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02328
Nickel (Ni)7440-02-00.130671.278720.59598
subTotal10.21900100.0000046.60770
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.50215
FillerSilica -amorphous-7631-86-90.395003.490001.80154
Silica fused60676-86-09.5999384.8200043.78422
PigmentCarbon black1333-86-40.018110.160000.08259
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55750
Epoxy resin systemProprietary0.179961.590000.82076
Phenolic resinProprietary0.254662.250001.16145
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.90995
subTotal11.31800100.0000051.62016
WirePure metalCopper (Cu)7440-50-80.0615196.550000.28053
Pure metal layerGold (Au)7440-57-50.000220.350000.00102
Palladium (Pd)7440-05-30.001973.100000.00901
subTotal0.06371100.000000.29056
total21.92554100.00000100.00000
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