Chemical content 74HC139PW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC139PW-Q100SOT403-1TSSOP1660.51381 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301197118612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21884
PolymerAcrylic resinProprietary0.0258415.200000.04270
Resin systemProprietary0.011736.900000.01938
DieDoped siliconSilicon (Si)7440-21-30.31660100.000000.52319
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.91532
Iron (Fe)7439-89-60.475552.400000.78585
Phosphorus (P)7723-14-00.005940.030000.00982
Zinc (Zn)7440-66-60.019810.100000.03274
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39264
Silica fused60676-86-031.0186878.3300051.25884
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.99182
PigmentCarbon black1333-86-40.079200.200000.13088
PolymerEpoxy resin systemProprietary3.509358.862005.79926
Phenolic resinProprietary2.339575.908003.86617
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02494
Nickel (Ni)7440-02-00.4642592.300000.76718
Palladium (Pd)7440-05-30.015593.100000.02577
Silver (Ag)7440-22-40.008051.600000.01330
WirePure metalCopper (Cu)7440-50-80.10975100.000000.18136
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.