Chemical content 74HC153PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC153PW-Q100SOT403-1TSSOP1660.72089 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300779118812601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21810
PolymerAcrylic resinProprietary0.0258415.200000.04256
Resin systemProprietary0.011736.900000.01932
DieDoped siliconSilicon (Si)7440-21-30.52838100.000000.87018
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.80647
Iron (Fe)7439-89-60.475552.400000.78317
Phosphorus (P)7723-14-00.005940.030000.00979
Zinc (Zn)7440-66-60.019810.100000.03263
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39130
Silica fused60676-86-031.0186878.3300051.08403
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.97820
PigmentCarbon black1333-86-40.079200.200000.13043
PolymerEpoxy resin systemProprietary3.509358.862005.77948
Phenolic resinProprietary2.339575.908003.85299
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02485
Nickel (Ni)7440-02-00.4642592.300000.76456
Palladium (Pd)7440-05-30.015593.100000.02568
Silver (Ag)7440-22-40.008051.600000.01325
WirePure metalCopper (Cu)7440-50-80.10505100.000000.17301
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.