Chemical content 74HC157BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC157BQ-Q100SOT763-1DHVQFN1621.65184 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298904115712601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00460
FillerSilver (Ag)7440-22-40.0747675.000000.34528
PolymerAcrylic resinProprietary0.005986.000000.02762
Resin systemProprietary0.0179418.000000.08287
DieDoped siliconSilicon (Si)7440-21-30.32683100.000001.50947
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.83139
Iron (Fe)7439-89-60.196362.400000.90690
Phosphorus (P)7723-14-00.002450.030000.01134
Zinc (Zn)7440-66-60.008180.100000.03779
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67173
FillerSilica -amorphous-7631-86-90.434103.490002.00492
Silica fused60676-86-010.5503184.8200048.72708
PigmentCarbon black1333-86-40.019900.160000.09192
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62043
Epoxy resin systemProprietary0.197771.590000.91342
Phenolic resinProprietary0.279872.250001.29257
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.12556
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07558
Nickel (Ni)7440-02-00.5035192.300002.32546
Palladium (Pd)7440-05-30.016913.100000.07810
Silver (Ag)7440-22-40.008731.600000.04031
WirePure metalCopper (Cu)7440-50-80.0576396.550000.26615
Pure metal layerGold (Au)7440-57-50.000210.350000.00096
Palladium (Pd)7440-05-30.001853.100000.00855
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.