Chemical content 74HC157BQ

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Type numberPackagePackage descriptionTotal product weight
74HC157BQSOT763-1DHVQFN1621.38649 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352944231151112601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00466
FillerSilver (Ag)7440-22-40.0747675.000000.34957
PolymerAcrylic resinProprietary0.005986.000000.02797
Resin systemProprietary0.0179418.000000.08390
DieDoped siliconSilicon (Si)7440-21-30.32683100.000001.52820
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.61054
Iron (Fe)7439-89-60.198062.400000.92608
Phosphorus (P)7723-14-00.002480.030000.01158
Zinc (Zn)7440-66-60.008250.100000.03859
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.69247
FillerSilica -amorphous-7631-86-90.434103.490002.02980
Silica fused60676-86-010.5503084.8200049.33162
PigmentCarbon black1333-86-40.019900.160000.09306
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62813
Epoxy resin systemProprietary0.197771.590000.92475
Phenolic resinProprietary0.279872.250001.30861
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.15193
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00979
Nickel (Ni)7440-02-00.1906391.000000.89134
Palladium (Pd)7440-05-30.016768.000000.07836
WirePure metalCopper (Cu)7440-50-80.0576396.550000.26945
Pure metal layerGold (Au)7440-57-50.000210.350000.00098
Palladium (Pd)7440-05-30.001853.100000.00865
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.