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Chemical content 74HC238BQ

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Type numberPackagePackage descriptionTotal product weight
74HC238BQSOT763-1DHVQFN1621.91792 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352836811151312601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29602
PolymerResin systemProprietary0.0161219.900000.07354
subTotal0.08100100.000000.36956
DieDoped siliconSilicon (Si)7440-21-30.23745100.000001.08336
subTotal0.23745100.000001.08336
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.80538
Iron (Fe)7439-89-60.237082.320001.08168
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03730
Zinc (Zn)7440-66-60.012260.120000.05595
Gold alloyGold (Au)7440-57-50.003060.029970.01397
Silver (Ag)7440-22-40.002040.019980.00932
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02329
Nickel (Ni)7440-02-00.130671.278720.59619
subTotal10.21900100.0000046.62391
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.50267
FillerSilica -amorphous-7631-86-90.395003.490001.80217
Silica fused60676-86-09.5999384.8200043.79945
PigmentCarbon black1333-86-40.018110.160000.08262
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55769
Epoxy resin systemProprietary0.179961.590000.82105
Phenolic resinProprietary0.254662.250001.16186
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.91061
subTotal11.31800100.0000051.63812
WirePure metalCopper (Cu)7440-50-80.0603296.550000.27520
Pure metal layerGold (Au)7440-57-50.000220.350000.00100
Palladium (Pd)7440-05-30.001943.100000.00884
subTotal0.06247100.000000.28504
total21.91792100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.