Chemical content 74HC238BQ

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Type numberPackagePackage descriptionTotal product weight
74HC238BQSOT763-1DHVQFN1621.11031 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93528368111512126030 s123520 s3Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0720980.100000.34149
PolymerResin systemProprietary0.0179119.900000.08484
DieDoped siliconSilicon (Si)7440-21-30.33243100.000001.57473
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.6026697.4700036.01397
Iron (Fe)7439-89-60.187202.400000.88677
Phosphorus (P)7723-14-00.002340.030000.01108
Zinc (Zn)7440-66-60.007800.100000.03695
Mould CompoundFillerSilica -amorphous-7631-86-91.001497.980004.74408
Silica fused60676-86-010.0515580.0920047.61439
PigmentCarbon black1333-86-40.116460.928000.55169
PolymerEpoxy resin systemProprietary1.060488.450005.02349
Phenolic resinProprietary0.320022.550001.51597
Pre-PlatingPure metal layerGold (Au)7440-57-50.008103.000000.03837
Nickel (Ni)7440-02-00.2492192.300001.18051
Palladium (Pd)7440-05-30.008373.100000.03965
Silver (Ag)7440-22-40.004321.600000.02046
WirePure metalCopper (Cu)7440-50-80.06788100.000000.32154
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.