×

Chemical content 74HC245BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC245BQ-Q100SOT764-1DHVQFN2028.16224 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353010191151112601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24256
PolymerResin systemProprietary0.0169719.900000.06026
subTotal0.08528100.000000.30282
DieDoped siliconSilicon (Si)7440-21-30.48091100.000001.70765
subTotal0.48091100.000001.70765
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5889697.4700037.59983
Iron (Fe)7439-89-60.260732.400000.92582
Phosphorus (P)7723-14-00.003260.030000.01157
Zinc (Zn)7440-66-60.010860.100000.03858
subTotal10.86381100.0000038.57580
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.69202
FillerSilica -amorphous-7631-86-90.571483.490002.02926
Silica fused60676-86-013.8892184.8200049.31855
PigmentCarbon black1333-86-40.026200.160000.09303
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62797
Epoxy resin systemProprietary0.260361.590000.92450
Phenolic resinProprietary0.368442.250001.30826
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.15136
subTotal16.37492100.0000058.14495
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00979
Nickel (Ni)7440-02-00.2509691.000000.89112
Palladium (Pd)7440-05-30.022068.000000.07834
subTotal0.27578100.000000.97925
WirePure metalCopper (Cu)7440-50-80.0787296.550000.27952
Pure metal layerGold (Au)7440-57-50.000290.350000.00101
Palladium (Pd)7440-05-30.002533.100000.00897
subTotal0.08153100.000000.28950
total28.16224100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.