×

Chemical content 74HC245BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC245BQSOT764-1DHVQFN2028.16498 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352786451151612601235Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands; Hsin-chu, Taiwan; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24253
PolymerResin systemProprietary0.0169719.900000.06025
subTotal0.08528100.000000.30278
DieDoped siliconSilicon (Si)7440-21-30.48091100.000001.70748
subTotal0.48091100.000001.70748
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.59690
Iron (Fe)7439-89-60.260742.400000.92575
Phosphorus (P)7723-14-00.003260.030000.01157
Zinc (Zn)7440-66-60.010860.100000.03857
subTotal10.86402100.0000038.57279
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.69185
FillerSilica -amorphous-7631-86-90.571483.490002.02906
Silica fused60676-86-013.8892084.8200049.31372
PigmentCarbon black1333-86-40.026200.160000.09302
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62790
Epoxy resin systemProprietary0.260361.590000.92441
Phenolic resinProprietary0.368442.250001.30813
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.15115
subTotal16.37491100.0000058.13924
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00979
Nickel (Ni)7440-02-00.2509591.000000.89100
Palladium (Pd)7440-05-30.022068.000000.07833
subTotal0.27577100.000000.97912
WirePure metalCopper (Cu)7440-50-80.0811996.550000.28827
Pure metal layerGold (Au)7440-57-50.000290.350000.00104
Palladium (Pd)7440-05-30.002613.100000.00926
subTotal0.08409100.000000.29857
total28.16498100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.