Chemical content 74HC257PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC257PW-Q100SOT403-1TSSOP1660.48825 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935307058118712601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21894
PolymerAcrylic resinProprietary0.0258415.200000.04272
Resin systemProprietary0.011736.900000.01939
DieDoped siliconSilicon (Si)7440-21-30.28510100.000000.47133
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.92880
Iron (Fe)7439-89-60.475552.400000.78618
Phosphorus (P)7723-14-00.005940.030000.00983
Zinc (Zn)7440-66-60.019810.100000.03276
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39280
Silica fused60676-86-031.0186878.3300051.28050
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.99350
PigmentCarbon black1333-86-40.079200.200000.13093
PolymerEpoxy resin systemProprietary3.509358.862005.80171
Phenolic resinProprietary2.339575.908003.86781
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02495
Nickel (Ni)7440-02-00.4642592.300000.76751
Palladium (Pd)7440-05-30.015593.100000.02578
Silver (Ag)7440-22-40.008051.600000.01330
WirePure metalCopper (Cu)7440-50-80.11569100.000000.19126
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.