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Chemical content 74HC259BQ

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Type numberPackagePackage descriptionTotal product weight
74HC259BQSOT763-1DHVQFN1622.16488 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352884551151612601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29272
PolymerResin systemProprietary0.0161219.900000.07272
subTotal0.08100100.000000.36544
DieDoped siliconSilicon (Si)7440-21-30.49157100.000002.21780
subTotal0.49157100.000002.21780
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.30616
Iron (Fe)7439-89-60.237082.320001.06962
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03688
Zinc (Zn)7440-66-60.012260.120000.05533
Gold alloyGold (Au)7440-57-50.003060.029970.01382
Silver (Ag)7440-22-40.002040.019980.00921
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02303
Nickel (Ni)7440-02-00.130671.278720.58955
subTotal10.21900100.0000046.10442
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.48593
FillerSilica -amorphous-7631-86-90.395003.490001.78209
Silica fused60676-86-09.5999384.8200043.31144
PigmentCarbon black1333-86-40.018110.160000.08170
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55148
Epoxy resin systemProprietary0.179961.590000.81190
Phenolic resinProprietary0.254662.250001.14891
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.88932
subTotal11.31800100.0000051.06277
WirePure metalCopper (Cu)7440-50-80.0534096.550000.24091
Pure metal layerGold (Au)7440-57-50.000190.350000.00087
Palladium (Pd)7440-05-30.001713.100000.00774
subTotal0.05531100.000000.24952
total22.16488100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.