Chemical content 74HC273BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC273BQ-Q100SOT764-1DHVQFN2028.35119 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301457115512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24094
PolymerResin systemProprietary0.0169719.900000.05986
DieDoped siliconSilicon (Si)7440-21-30.31454100.000001.10944
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700037.03010
Iron (Fe)7439-89-60.258502.400000.91179
Phosphorus (P)7723-14-00.003230.030000.01140
Zinc (Zn)7440-66-60.010770.100000.03799
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.68074
FillerSilica -amorphous-7631-86-90.571483.490002.01573
Silica fused60676-86-013.8892184.8200048.98986
PigmentCarbon black1333-86-40.026200.160000.09241
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62378
Epoxy resin systemProprietary0.260361.590000.91834
Phenolic resinProprietary0.368442.250001.29954
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13703
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07599
Nickel (Ni)7440-02-00.6628292.300002.33791
Palladium (Pd)7440-05-30.022263.100000.07852
Silver (Ag)7440-22-40.011491.600000.04053
WirePure metalCopper (Cu)7440-50-80.0843496.550000.29748
Pure metal layerGold (Au)7440-57-50.000310.350000.00108
Palladium (Pd)7440-05-30.002713.100000.00955
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.