Chemical content 74HC273D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC273D-Q100SOT163-1SO20665.27333 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935301455118612601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0467477.900000.00703
PolymerAcrylic resinProprietary0.0091215.200000.00137
Resin systemProprietary0.004146.900000.00062
DieDoped siliconSilicon (Si)7440-21-30.44035100.000000.06619
Lead FrameCopper alloyCopper (Cu)7440-50-8130.8168596.0970019.66362
Iron (Fe)7439-89-63.154132.317000.47411
Lead (Pb)7439-92-10.006130.004500.00092
Phosphorus (P)7723-14-00.110270.081000.01657
Zinc (Zn)7440-66-60.167440.123000.02517
Pure metal layerGold (Au)7440-57-50.037440.027500.00563
Nickel (Ni)7440-02-01.741781.279500.26181
Palladium (Pd)7440-05-30.066700.049000.01003
Silver (Ag)7440-22-40.029270.021500.00440
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8130.8632297.4700019.67059
Iron (Fe)7439-89-63.222242.400000.48435
Phosphorus (P)7723-14-00.040280.030000.00605
Zinc (Zn)7440-66-60.134260.100000.02018
Mould CompoundFillerSilica -amorphous-7631-86-92.365260.600000.35553
Silica fused60676-86-0308.7846978.3300046.41471
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-824.046816.100003.61458
PigmentCarbon black1333-86-40.788420.200000.11851
PolymerEpoxy resin systemProprietary34.934898.862005.25121
Phenolic resinProprietary23.289935.908003.50081
WirePure metalCopper (Cu)7440-50-80.17297100.000000.02600
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.