Chemical content 74HC4017PW

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Type numberPackagePackage descriptionTotal product weight
74HC4017PWSOT403-1TSSOP1663.69218 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93518908011811126030 s123520 s3Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.62881
PolymerResin systemProprietary0.0995019.900000.15622
DieDoped siliconSilicon (Si)7440-21-30.58667100.000000.92110
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700058.15251
Iron (Fe)7439-89-60.912002.400001.43189
Phosphorus (P)7723-14-00.011400.030000.01790
Zinc (Zn)7440-66-60.038000.100000.05966
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.69723
FillerSilica fused60676-86-018.1700079.0000028.52783
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.16667
PigmentCarbon black1333-86-40.046000.200000.07222
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.44445
Non hazardousProprietary0.943004.100001.48056
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.72222
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02355
Nickel (Ni)7440-02-01.4550097.000002.28442
Palladium (Pd)7440-05-30.030002.000000.04710
WirePure metalCopper (Cu)7440-50-80.10551100.000000.16566
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.