Chemical content 74HC4017PW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC4017PWSOT403-1TSSOP1653.06456 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9351890801181212601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.22020
PolymerAcrylic resinProprietary0.0228015.200000.04297
Resin systemProprietary0.010356.900000.01950
DieDoped siliconSilicon (Si)7440-21-30.41905100.000000.78970
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.48948
Iron (Fe)7439-89-60.489842.400000.92310
Phosphorus (P)7723-14-00.006120.030000.01154
Zinc (Zn)7440-66-60.020410.100000.03846
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.35821
Silica fused60676-86-024.8149478.3300046.76369
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.64175
PigmentCarbon black1333-86-40.063360.200000.11940
PolymerEpoxy resin systemProprietary2.807488.862005.29069
Phenolic resinProprietary1.871655.908003.52713
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00565
Nickel (Ni)7440-02-00.2910097.000000.54839
Palladium (Pd)7440-05-30.006002.000000.01131
WirePure metalCopper (Cu)7440-50-80.10551100.000000.19884
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.