Chemical content 74HC4051BZ

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Type numberPackagePackage descriptionTotal product weight
74HC4051BZSOT8016-1DHXQFN166.66593 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691404115412601235Shanghai, China; Jiangyin, China; Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0115060.000000.17255
ImpurityNon hazardousProprietary0.000010.039500.00011
PolymerResin systemProprietary0.0076639.951410.11489
DieDoped siliconSilicon (Si)7440-21-30.26134100.000003.92059
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.0022197.0000045.03810
Nickel (Ni)7440-02-00.092853.000001.39293
Mould CompoundAdditiveNon hazardousProprietary0.093752.900001.40641
FillerSilica fused60676-86-02.8755488.9500043.13787
PigmentCarbon black1333-86-40.004850.150000.07275
PolymerEpoxy resin systemProprietary0.047521.470000.71290
Phenolic resinProprietary0.100543.110001.50825
Tetramethylbiphenyl diglycidyl ether85954-11-60.110563.420001.65859
Pre-PlatingPure metal layerGold (Au)7440-57-50.000161.000000.00243
Nickel (Ni)7440-02-00.0147291.000000.22088
Palladium (Pd)7440-05-30.001298.000000.01942
WirePure metalCopper (Cu)7440-50-80.0399996.550000.59986
Pure metal layerGold (Au)7440-57-50.000140.350000.00217
Palladium (Pd)7440-05-30.001283.100000.01926
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.