×

Chemical content 74HC4052BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC4052BQSOT763-1DHVQFN1621.58806 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736891152312601235Nijmegen, Netherlands; Jiangyin, China; Bangkok, Thailand; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13897
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09253
subTotal0.05000100.000000.23159
DieDoped siliconSilicon (Si)7440-21-30.58076100.000002.69021
subTotal0.58076100.000002.69021
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.25937
Iron (Fe)7439-89-60.198062.400000.91744
Phosphorus (P)7723-14-00.002480.030000.01147
Zinc (Zn)7440-66-60.008250.100000.03823
subTotal8.25236100.0000038.22651
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67666
FillerSilica -amorphous-7631-86-90.434103.490002.01084
Silica fused60676-86-010.5503084.8200048.87100
PigmentCarbon black1333-86-40.019900.160000.09219
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62227
Epoxy resin systemProprietary0.197771.590000.91612
Phenolic resinProprietary0.279872.250001.29639
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.13184
subTotal12.43846100.0000057.61731
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00970
Nickel (Ni)7440-02-00.1906391.000000.88302
Palladium (Pd)7440-05-30.016768.000000.07763
subTotal0.20948100.000000.97035
WirePure metalCopper (Cu)7440-50-80.0550396.550000.25492
Pure metal layerGold (Au)7440-57-50.000200.350000.00092
Palladium (Pd)7440-05-30.001773.100000.00819
subTotal0.05700100.000000.26403
total21.58806100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.