Chemical content 74HC4052BZ

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Type numberPackagePackage descriptionTotal product weight
74HC4052BZSOT8016-1DHXQFN166.66873 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9356914991154126030 s123520 s3Suzhou, China; Jiangyin, China; Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0115060.000000.17248
ImpurityNon hazardousProprietary0.000010.039500.00011
PolymerResin systemProprietary0.0076639.951410.11484
DieDoped siliconSilicon (Si)7440-21-30.26134100.000003.91895
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.0022197.0000045.01919
Nickel (Ni)7440-02-00.092853.000001.39235
Mould CompoundAdditiveNon hazardousProprietary0.096472.984001.44654
FillerSilica -amorphous-7631-86-90.112823.490001.69183
Silica fused60676-86-02.7420384.8200041.11768
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.032391.002000.48573
PigmentCarbon black1333-86-40.005300.164000.07950
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.119643.701001.79411
Epoxy resin systemProprietary0.051271.586000.76884
Phenolic resinProprietary0.072832.253001.09217
Pre-PlatingPure metal layerGold (Au)7440-57-50.000161.000000.00243
Nickel (Ni)7440-02-00.0147291.000000.22079
Palladium (Pd)7440-05-30.001298.000000.01941
WirePure metalCopper (Cu)7440-50-80.0426996.550000.64022
Pure metal layerGold (Au)7440-57-50.000150.350000.00232
Palladium (Pd)7440-05-30.001373.100000.02056
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.