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Chemical content 74HC4060BQ

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Type numberPackagePackage descriptionTotal product weight
74HC4060BQSOT763-1DHVQFN1621.81167 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352864021151212601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13754
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09158
subTotal0.05000100.000000.22921
DieDoped siliconSilicon (Si)7440-21-30.80744100.000003.70187
subTotal0.80744100.000003.70187
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.87739
Iron (Fe)7439-89-60.198062.400000.90803
Phosphorus (P)7723-14-00.002480.030000.01135
Zinc (Zn)7440-66-60.008250.100000.03783
subTotal8.25236100.0000037.83460
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65947
FillerSilica -amorphous-7631-86-90.434103.490001.99023
Silica fused60676-86-010.5503084.8200048.36999
PigmentCarbon black1333-86-40.019900.160000.09124
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61589
Epoxy resin systemProprietary0.197771.590000.90672
Phenolic resinProprietary0.279872.250001.28310
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10999
subTotal12.43846100.0000057.02663
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00960
Nickel (Ni)7440-02-00.1906391.000000.87397
Palladium (Pd)7440-05-30.016768.000000.07683
subTotal0.20948100.000000.96040
WirePure metalCopper (Cu)7440-50-80.05393100.000000.24727
subTotal0.05393100.000000.24727
total21.81167100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.