Chemical content 74HC4351D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4351D-Q100SOT163-1SO20532.72979 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691588118312601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0467477.900000.00877
PolymerAcrylic resinProprietary0.0091215.200000.00171
Resin systemProprietary0.004146.900000.00078
DieDoped siliconSilicon (Si)7440-21-31.73579100.000000.32583
Lead FrameCopper alloyCopper (Cu)7440-50-8136.1310196.0970025.55348
Iron (Fe)7439-89-63.282262.317000.61612
Lead (Pb)7439-92-10.006370.004500.00120
Phosphorus (P)7723-14-00.114740.081000.02154
Zinc (Zn)7440-66-60.174240.123000.03271
Pure metal layerGold (Au)7440-57-50.038960.027500.00731
Nickel (Ni)7440-02-01.812541.279500.34024
Palladium (Pd)7440-05-30.069410.049000.01303
Silver (Ag)7440-22-40.030460.021500.00572
Mould CompoundFillerSilica -amorphous-7631-86-92.335620.600000.43842
Silica fused60676-86-0304.9151978.3300057.23637
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-823.745476.100004.45732
PigmentCarbon black1333-86-40.778540.200000.14614
PolymerEpoxy resin systemProprietary34.497118.862006.47554
Phenolic resinProprietary22.998075.908004.31702
WirePure metalCopper (Cu)7440-50-80.00400100.000000.00075
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.