Chemical content 74HC4852BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4852BQ-Q100SOT763-1DHVQFN1621.89309 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298467115712601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0300060.000000.13703
ImpurityNon hazardousProprietary0.000020.039500.00009
PolymerResin systemProprietary0.0199839.951410.09124
DieDoped siliconSilicon (Si)7440-21-30.89661100.000004.09539
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.74025
Iron (Fe)7439-89-60.198062.400000.90465
Phosphorus (P)7723-14-00.002480.030000.01131
Zinc (Zn)7440-66-60.008250.100000.03769
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.65330
FillerSilica -amorphous-7631-86-90.434103.490001.98283
Silica fused60676-86-010.5503084.8200048.19010
PigmentCarbon black1333-86-40.019900.160000.09090
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61360
Epoxy resin systemProprietary0.197771.590000.90335
Phenolic resinProprietary0.279872.250001.27833
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.10214
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00957
Nickel (Ni)7440-02-00.1906391.000000.87072
Palladium (Pd)7440-05-30.016768.000000.07655
WirePure metalCopper (Cu)7440-50-80.0445996.550000.20366
Pure metal layerGold (Au)7440-57-50.000160.350000.00074
Palladium (Pd)7440-05-30.001433.100000.00654
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.