Chemical content 74HC4852PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC4852PW-Q100SOT403-1TSSOP1661.07393 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352984691181112601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21684
PolymerAcrylic resinProprietary0.0258415.200000.04231
Resin systemProprietary0.011736.900000.01921
DieDoped siliconSilicon (Si)7440-21-30.89661100.000001.46807
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.62261
Iron (Fe)7439-89-60.475552.400000.77864
Phosphorus (P)7723-14-00.005940.030000.00973
Zinc (Zn)7440-66-60.019810.100000.03244
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.38904
Silica fused60676-86-031.0186878.3300050.78874
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.95521
PigmentCarbon black1333-86-40.079200.200000.12968
PolymerEpoxy resin systemProprietary3.509358.862005.74607
Phenolic resinProprietary2.339575.908003.83071
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02471
Nickel (Ni)7440-02-00.4642592.300000.76015
Palladium (Pd)7440-05-30.015593.100000.02553
Silver (Ag)7440-22-40.008051.600000.01318
WirePure metalCopper (Cu)7440-50-80.08987100.000000.14714
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.