Chemical content 74HC573BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC573BQ-Q100SOT764-1DHVQFN2028.34822 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298863115912601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00301
FillerSilver (Ag)7440-22-40.0639675.000000.22562
PolymerAcrylic resinProprietary0.005126.000000.01805
Resin systemProprietary0.0153518.000000.05415
DieDoped siliconSilicon (Si)7440-21-30.31140100.000001.09850
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700037.03398
Iron (Fe)7439-89-60.258502.400000.91189
Phosphorus (P)7723-14-00.003230.030000.01140
Zinc (Zn)7440-66-60.010770.100000.03800
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.68092
FillerSilica -amorphous-7631-86-90.571483.490002.01595
Silica fused60676-86-013.8892184.8200048.99499
PigmentCarbon black1333-86-40.026200.160000.09242
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62385
Epoxy resin systemProprietary0.260361.590000.91844
Phenolic resinProprietary0.368442.250001.29968
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13725
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07600
Nickel (Ni)7440-02-00.6628292.300002.33815
Palladium (Pd)7440-05-30.022263.100000.07853
Silver (Ag)7440-22-40.011491.600000.04053
WirePure metalCopper (Cu)7440-50-80.0845096.550000.29807
Pure metal layerGold (Au)7440-57-50.000310.350000.00108
Palladium (Pd)7440-05-30.002713.100000.00957
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.