Chemical content 74HC573D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC573D-Q100SOT163-1SO20665.26920 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298864118912601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0467477.900000.00703
PolymerAcrylic resinProprietary0.0091215.200000.00137
Resin systemProprietary0.004146.900000.00062
DieDoped siliconSilicon (Si)7440-21-30.43597100.000000.06553
Lead FrameCopper alloyCopper (Cu)7440-50-8130.8168596.0970019.66375
Iron (Fe)7439-89-63.154132.317000.47411
Lead (Pb)7439-92-10.006130.004500.00092
Phosphorus (P)7723-14-00.110270.081000.01657
Zinc (Zn)7440-66-60.167440.123000.02517
Pure metal layerGold (Au)7440-57-50.037440.027500.00563
Nickel (Ni)7440-02-01.741781.279500.26182
Palladium (Pd)7440-05-30.066700.049000.01003
Silver (Ag)7440-22-40.029270.021500.00440
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8130.8632297.4700019.67072
Iron (Fe)7439-89-63.222242.400000.48435
Phosphorus (P)7723-14-00.040280.030000.00605
Zinc (Zn)7440-66-60.134260.100000.02018
Mould CompoundFillerSilica -amorphous-7631-86-92.365260.600000.35553
Silica fused60676-86-0308.7846978.3300046.41500
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-824.046816.100003.61460
PigmentCarbon black1333-86-40.788420.200000.11851
PolymerEpoxy resin systemProprietary34.934898.862005.25124
Phenolic resinProprietary23.289935.908003.50083
WirePure metalCopper (Cu)7440-50-80.17323100.000000.02604
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.