Chemical content 74HC574PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC574PW-Q100SOT360-1TSSOP2083.31778 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298938118812601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.03740
PolymerAcrylic resinProprietary0.0060815.200000.00730
Resin systemProprietary0.002766.900000.00331
DieDoped siliconSilicon (Si)7440-21-30.31539100.000000.37854
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-829.7946697.4700035.76026
Iron (Fe)7439-89-60.733632.400000.88052
Phosphorus (P)7723-14-00.009170.030000.01101
Zinc (Zn)7440-66-60.030570.100000.03669
Mould CompoundFillerSilica -amorphous-7631-86-90.308880.600000.37073
Silica fused60676-86-040.3242878.3300048.39817
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.140286.100003.76904
PigmentCarbon black1333-86-40.102960.200000.12358
PolymerEpoxy resin systemProprietary4.562168.862005.47561
Phenolic resinProprietary3.041445.908003.65041
Pre-PlatingPure metal layerGold (Au)7440-57-50.023283.000000.02794
Nickel (Ni)7440-02-00.7162192.300000.85961
Palladium (Pd)7440-05-30.024053.100000.02887
Silver (Ag)7440-22-40.012421.600000.01490
WirePure metalCopper (Cu)7440-50-80.13840100.000000.16612
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.