Chemical content 74HC595BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HC595BQ-Q100SOT763-1DHVQFN1621.44700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352988731151312601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001001.000000.00465
FillerSilver (Ag)7440-22-40.0747675.000000.34858
PolymerAcrylic resinProprietary0.005986.000000.02789
Resin systemProprietary0.0179418.000000.08366
DieDoped siliconSilicon (Si)7440-21-30.38940100.000001.81564
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0434197.4700037.50366
Iron (Fe)7439-89-60.198052.400000.92345
Phosphorus (P)7723-14-00.002480.030000.01154
Zinc (Zn)7440-66-60.008250.100000.03848
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.68769
FillerSilica -amorphous-7631-86-90.434103.490002.02407
Silica fused60676-86-010.5503184.8200049.19248
PigmentCarbon black1333-86-40.019900.160000.09279
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62636
Epoxy resin systemProprietary0.197771.590000.92214
Phenolic resinProprietary0.279872.250001.30492
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.14586
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00977
Nickel (Ni)7440-02-00.1906491.000000.88887
Palladium (Pd)7440-05-30.016768.000000.07814
WirePure metalCopper (Cu)7440-50-80.0557796.550000.26004
Pure metal layerGold (Au)7440-57-50.000200.350000.00094
Palladium (Pd)7440-05-30.001793.100000.00835
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.