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Chemical content 74HC595BQ

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Type numberPackagePackage descriptionTotal product weight
74HC595BQSOT763-1DHVQFN1622.06517 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736791151912601235Jiangyin, China; Suzhou, China; Bangkok, Thailand; Hsin-chu, Taiwan; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29404
PolymerResin systemProprietary0.0161219.900000.07305
subTotal0.08100100.000000.36709
DieDoped siliconSilicon (Si)7440-21-30.38940100.000001.76478
subTotal0.38940100.000001.76478
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.50638
Iron (Fe)7439-89-60.237082.320001.07446
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03705
Zinc (Zn)7440-66-60.012260.120000.05558
Gold alloyGold (Au)7440-57-50.003060.029970.01388
Silver (Ag)7440-22-40.002040.019980.00925
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02313
Nickel (Ni)7440-02-00.130671.278720.59221
subTotal10.21900100.0000046.31276
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49264
FillerSilica -amorphous-7631-86-90.395003.490001.79014
Silica fused60676-86-09.5999384.8200043.50715
PigmentCarbon black1333-86-40.018110.160000.08207
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55397
Epoxy resin systemProprietary0.179961.590000.81557
Phenolic resinProprietary0.254662.250001.15410
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.89786
subTotal11.31800100.0000051.29350
WirePure metalCopper (Cu)7440-50-80.0557796.550000.25276
Pure metal layerGold (Au)7440-57-50.000200.350000.00092
Palladium (Pd)7440-05-30.001793.100000.00812
subTotal0.05776100.000000.26180
total22.06517100.00000100.00000
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