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Chemical content 74HC595BZ

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Type numberPackagePackage descriptionTotal product weight
74HC595BZSOT8016-1DHXQFN166.58599 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691142115612601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China; Shanghai, China; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0115060.000000.17464
ImpurityNon hazardousProprietary0.000010.039500.00011
PolymerResin systemProprietary0.0076639.951410.11629
subTotal0.01917100.000000.29104
DieDoped siliconSilicon (Si)7440-21-30.17523100.000002.66066
subTotal0.17523100.000002.66066
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.0022197.0000045.58477
Nickel (Ni)7440-02-00.092853.000001.40984
subTotal3.09506100.0000046.99461
Mould CompoundAdditiveNon hazardousProprietary0.093752.900001.42348
FillerSilica fused60676-86-02.8755488.9500043.66147
PigmentCarbon black1333-86-40.004850.150000.07363
PolymerEpoxy resin systemProprietary0.047521.470000.72156
Phenolic resinProprietary0.100543.110001.52656
Tetramethylbiphenyl diglycidyl ether85954-11-60.110563.420001.67872
subTotal3.23276100.0000049.08542
Pre-PlatingPure metal layerGold (Au)7440-57-50.000161.000000.00246
Nickel (Ni)7440-02-00.0147291.000000.22356
Palladium (Pd)7440-05-30.001298.000000.01965
subTotal0.01618100.000000.24567
WirePure metalCopper (Cu)7440-50-80.0459596.550000.69773
Pure metal layerGold (Au)7440-57-50.000170.350000.00253
Palladium (Pd)7440-05-30.001483.100000.02240
subTotal0.04759100.000000.72266
total6.58599100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.