Chemical content 74HC595D

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Type numberPackagePackage descriptionTotal product weight
74HC595DSOT109-1SO16137.53197 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93500916011823126030 s123520 s3Bangkok, Thailand; Jiangsu, China; Hsin-chu, Taiwan; Jiangyin, China; Suzhou, China; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1311577.900000.09536
PolymerAcrylic resinProprietary0.0255915.200000.01861
Resin systemProprietary0.011626.900000.00845
DieDoped siliconSilicon (Si)7440-21-30.38940100.000000.28314
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-848.6504297.4700035.37390
Iron (Fe)7439-89-61.197922.400000.87101
Phosphorus (P)7723-14-00.014970.030000.01089
Zinc (Zn)7440-66-60.049910.100000.03629
Mould CompoundFillerSilica -amorphous-7631-86-90.513970.600000.37371
Silica fused60676-86-067.0991478.3300048.78803
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.225396.100003.79940
PigmentCarbon black1333-86-40.171320.200000.12457
PolymerEpoxy resin systemProprietary7.591388.862005.51972
Phenolic resinProprietary5.060925.908003.67981
Pre-PlatingPure metal layerGold (Au)7440-57-50.012791.000000.00930
Nickel (Ni)7440-02-01.2408897.000000.90225
Palladium (Pd)7440-05-30.025592.000000.01860
WirePure metalCopper (Cu)7440-50-80.11961100.000000.08697
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.