×

Chemical content 74HC595D

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC595DSOT109-1SO16137.53197 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9350091601182312601235Bangkok, Thailand; Jiangsu, China; Hsin-chu, Taiwan; Jiangyin, China; Suzhou, China; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1311577.900000.09536
PolymerAcrylic resinProprietary0.0255915.200000.01861
Resin systemProprietary0.011626.900000.00845
subTotal0.16836100.000000.12242
DieDoped siliconSilicon (Si)7440-21-30.38940100.000000.28314
subTotal0.38940100.000000.28314
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-848.6504297.4700035.37390
Iron (Fe)7439-89-61.197922.400000.87101
Phosphorus (P)7723-14-00.014970.030000.01089
Zinc (Zn)7440-66-60.049910.100000.03629
subTotal49.91322100.0000036.29209
Mould CompoundAdditiveNon hazardousProprietary4.026124.700002.92741
FillerSilica fused60676-86-067.6730779.0000049.20534
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.139736.000003.73711
PigmentCarbon black1333-86-40.171320.200000.12457
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.426484.000002.49141
Non hazardousProprietary3.512154.100002.55369
Tetramethylbiphenyl diglycidyl ether85954-11-61.713242.000001.24570
subTotal85.66212100.0000062.28523
Pre-PlatingPure metal layerGold (Au)7440-57-50.012791.000000.00930
Nickel (Ni)7440-02-01.2408897.000000.90225
Palladium (Pd)7440-05-30.025592.000000.01860
subTotal1.27926100.000000.93015
WirePure metalCopper (Cu)7440-50-80.11961100.000000.08697
subTotal0.11961100.000000.08697
total137.53197100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.