Chemical content 74HCT157PW

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Type numberPackagePackage descriptionTotal product weight
74HCT157PWSOT403-1TSSOP1652.97590 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9351885401181412601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.22057
PolymerAcrylic resinProprietary0.0228015.200000.04304
Resin systemProprietary0.010356.900000.01954
DieDoped siliconSilicon (Si)7440-21-30.32683100.000000.61694
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.55222
Iron (Fe)7439-89-60.489842.400000.92465
Phosphorus (P)7723-14-00.006120.030000.01156
Zinc (Zn)7440-66-60.020410.100000.03853
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.35880
Silica fused60676-86-024.8149478.3300046.84195
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.64785
PigmentCarbon black1333-86-40.063360.200000.11960
PolymerEpoxy resin systemProprietary2.807488.862005.29954
Phenolic resinProprietary1.871655.908003.53303
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00566
Nickel (Ni)7440-02-00.2910097.000000.54931
Palladium (Pd)7440-05-30.006002.000000.01133
WirePure metalCopper (Cu)7440-50-80.10907100.000000.20589
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.