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Chemical content 74HCT1G66GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT1G66GW-Q100SOT353-1UMT55.42879 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300004125512601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0300075.000000.55261
PolymerResin systemProprietary0.0100025.000000.18420
subTotal0.04000100.000000.73681
DieDoped siliconSilicon (Si)7440-21-30.16279100.000002.99856
subTotal0.16279100.000002.99856
Lead FrameCopper alloyCopper (Cu)7440-50-81.8818097.0000034.66334
Iron (Fe)7439-89-60.048892.520000.90053
Lead (Pb)7439-92-10.000580.030000.01072
Phosphorus (P)7723-14-00.002910.150000.05360
Zinc (Zn)7440-66-60.003880.200000.07147
Pure metal layerSilver (Ag)7440-22-40.001940.100000.03574
subTotal1.94000100.0000035.73540
Mould CompoundAdditiveNon hazardousProprietary0.089032.900001.63996
Triphenylphosphine603-35-00.001540.050000.02828
FillerSilica -amorphous-7631-86-92.2104072.0000040.71626
PigmentCarbon black1333-86-40.001540.050000.02828
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4605015.000008.48255
Phenol Formaldehyde resin (generic)9003-35-40.3070010.000005.65504
subTotal3.07000100.0000056.55037
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00018
Tin solderTin (Sn)7440-31-50.1999899.990003.68369
subTotal0.20000100.000003.68406
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0160099.990000.29473
subTotal0.01600100.000000.29476
total5.42879100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.