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Chemical content 74HCT259BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT259BQSOT763-1DHVQFN1621.74349 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352884561151312601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36721
PolymerResin systemProprietary0.0198419.900000.09123
subTotal0.09968100.000000.45844
DieDoped siliconSilicon (Si)7440-21-30.68820100.000003.16509
subTotal0.68820100.000003.16509
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700036.99303
Iron (Fe)7439-89-60.198062.400000.91088
Phosphorus (P)7723-14-00.002480.030000.01139
Zinc (Zn)7440-66-60.008250.100000.03795
subTotal8.25236100.0000037.95325
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.66468
FillerSilica -amorphous-7631-86-90.434103.490001.99647
Silica fused60676-86-010.5503084.8200048.52166
PigmentCarbon black1333-86-40.019900.160000.09153
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.61782
Epoxy resin systemProprietary0.197771.590000.90957
Phenolic resinProprietary0.279872.250001.28712
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.11660
subTotal12.43846100.0000057.20545
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00963
Nickel (Ni)7440-02-00.1906391.000000.87671
Palladium (Pd)7440-05-30.016768.000000.07707
subTotal0.20948100.000000.96341
WirePure metalCopper (Cu)7440-50-80.0534096.550000.24558
Pure metal layerGold (Au)7440-57-50.000190.350000.00089
Palladium (Pd)7440-05-30.001713.100000.00788
subTotal0.05531100.000000.25435
total21.74349100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.