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Chemical content 74HCT273BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT273BQSOT764-1DHVQFN2028.00183 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352745881151812601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24395
PolymerResin systemProprietary0.0169719.900000.06061
subTotal0.08528100.000000.30456
DieDoped siliconSilicon (Si)7440-21-30.31454100.000001.12328
subTotal0.31454100.000001.12328
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.81596
Iron (Fe)7439-89-60.260742.400000.93114
Phosphorus (P)7723-14-00.003260.030000.01164
Zinc (Zn)7440-66-60.010860.100000.03880
subTotal10.86402100.0000038.79754
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70171
FillerSilica -amorphous-7631-86-90.571483.490002.04088
Silica fused60676-86-013.8892084.8200049.60104
PigmentCarbon black1333-86-40.026200.160000.09356
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63156
Epoxy resin systemProprietary0.260361.590000.92980
Phenolic resinProprietary0.368442.250001.31575
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16369
subTotal16.37491100.0000058.47799
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00985
Nickel (Ni)7440-02-00.2509591.000000.89619
Palladium (Pd)7440-05-30.022068.000000.07879
subTotal0.27577100.000000.98483
WirePure metalCopper (Cu)7440-50-80.0843096.550000.30105
Pure metal layerGold (Au)7440-57-50.000310.350000.00109
Palladium (Pd)7440-05-30.002713.100000.00967
subTotal0.08731100.000000.31181
total28.00183100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.