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Chemical content 74HCT373BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT373BQ-Q100SOT764-1DHVQFN2028.28731 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299037115512601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24148
PolymerResin systemProprietary0.0169719.900000.05999
subTotal0.08528100.000000.30147
DieDoped siliconSilicon (Si)7440-21-30.33521100.000001.18500
subTotal0.33521100.000001.18500
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700037.11372
Iron (Fe)7439-89-60.258502.400000.91385
Phosphorus (P)7723-14-00.003230.030000.01142
Zinc (Zn)7440-66-60.010770.100000.03808
subTotal10.77098100.0000038.07707
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.68454
FillerSilica -amorphous-7631-86-90.571483.490002.02029
Silica fused60676-86-013.8892184.8200049.10049
PigmentCarbon black1333-86-40.026200.160000.09262
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62519
Epoxy resin systemProprietary0.260361.590000.92042
Phenolic resinProprietary0.368442.250001.30248
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.14185
subTotal16.37492100.0000057.88788
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07616
Nickel (Ni)7440-02-00.6628292.300002.34319
Palladium (Pd)7440-05-30.022263.100000.07870
Silver (Ag)7440-22-40.011491.600000.04062
subTotal0.71812100.000002.53867
WirePure metalCopper (Cu)7440-50-80.0027096.550000.00956
Pure metal layerGold (Au)7440-57-50.000010.350000.00003
Palladium (Pd)7440-05-30.000093.100000.00031
subTotal0.00280100.000000.00990
total28.28731100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.