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Chemical content 74HCT373BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT373BQ-Q100SOT764-1DHVQFN2028.28731 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352990371155126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00301
FillerSilver (Ag)7440-22-40.0639675.000000.22611
PolymerAcrylic resinProprietary0.005126.000000.01809
Resin systemProprietary0.0153518.000000.05427
subTotal0.08528100.000000.30148
DieDoped siliconSilicon (Si)7440-21-30.33521100.000001.18500
subTotal0.33521100.000001.18500
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700037.11372
Iron (Fe)7439-89-60.258502.400000.91385
Phosphorus (P)7723-14-00.003230.030000.01142
Zinc (Zn)7440-66-60.010770.100000.03808
subTotal10.77098100.0000038.07707
Mould CompoundAdditiveNon hazardousProprietary0.488632.984001.72737
FillerSilica -amorphous-7631-86-90.571483.490002.02029
Silica fused60676-86-013.8892184.8200049.10049
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.164081.002000.58004
PigmentCarbon black1333-86-40.026850.164000.09494
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.606043.701002.14243
Epoxy resin systemProprietary0.259711.586000.91810
Phenolic resinProprietary0.368932.253001.30421
subTotal16.37492100.0000057.88787
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07616
Nickel (Ni)7440-02-00.6628292.300002.34319
Palladium (Pd)7440-05-30.022263.100000.07870
Silver (Ag)7440-22-40.011491.600000.04062
subTotal0.71812100.000002.53867
WirePure metalCopper (Cu)7440-50-80.0027096.550000.00956
Pure metal layerGold (Au)7440-57-50.000010.350000.00003
Palladium (Pd)7440-05-30.000093.100000.00031
subTotal0.00280100.000000.00990
total28.28731100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.