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Chemical content 74HCT373BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT373BQSOT764-1DHVQFN2028.02139 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352745841151612601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24378
PolymerResin systemProprietary0.0169719.900000.06056
subTotal0.08528100.000000.30434
DieDoped siliconSilicon (Si)7440-21-30.33521100.000001.19625
subTotal0.33521100.000001.19625
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.78956
Iron (Fe)7439-89-60.260742.400000.93049
Phosphorus (P)7723-14-00.003260.030000.01163
Zinc (Zn)7440-66-60.010860.100000.03877
subTotal10.86402100.0000038.77045
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.70052
FillerSilica -amorphous-7631-86-90.571483.490002.03946
Silica fused60676-86-013.8892084.8200049.56642
PigmentCarbon black1333-86-40.026200.160000.09350
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.63112
Epoxy resin systemProprietary0.260361.590000.92915
Phenolic resinProprietary0.368442.250001.31484
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.16218
subTotal16.37491100.0000058.43719
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00984
Nickel (Ni)7440-02-00.2509591.000000.89557
Palladium (Pd)7440-05-30.022068.000000.07873
subTotal0.27577100.000000.98414
WirePure metalCopper (Cu)7440-50-80.0832396.550000.29702
Pure metal layerGold (Au)7440-57-50.000300.350000.00108
Palladium (Pd)7440-05-30.002673.100000.00954
subTotal0.08620100.000000.30764
total28.02139100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.