Chemical content 74HCT373D-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT373D-Q100SOT163-1SO20665.29981 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935299038118712601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0467477.900000.00703
PolymerAcrylic resinProprietary0.0091215.200000.00137
Resin systemProprietary0.004146.900000.00062
DieDoped siliconSilicon (Si)7440-21-30.46929100.000000.07054
Lead FrameCopper alloyCopper (Cu)7440-50-8130.8168596.0970019.66284
Iron (Fe)7439-89-63.154132.317000.47409
Lead (Pb)7439-92-10.006130.004500.00092
Phosphorus (P)7723-14-00.110270.081000.01657
Zinc (Zn)7440-66-60.167440.123000.02517
Pure metal layerGold (Au)7440-57-50.037440.027500.00563
Nickel (Ni)7440-02-01.741781.279500.26180
Palladium (Pd)7440-05-30.066700.049000.01003
Silver (Ag)7440-22-40.029270.021500.00440
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-8130.8632297.4700019.66981
Iron (Fe)7439-89-63.222242.400000.48433
Phosphorus (P)7723-14-00.040280.030000.00605
Zinc (Zn)7440-66-60.134260.100000.02018
Mould CompoundFillerSilica -amorphous-7631-86-92.365260.600000.35552
Silica fused60676-86-0308.7846978.3300046.41286
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-824.046816.100003.61443
PigmentCarbon black1333-86-40.788420.200000.11851
PolymerEpoxy resin systemProprietary34.934898.862005.25100
Phenolic resinProprietary23.289935.908003.50067
WirePure metalCopper (Cu)7440-50-80.17053100.000000.02563
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.