Chemical content 74HCT4017BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT4017BQSOT763-1DHVQFN1622.09472 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352853581151012601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29365
PolymerResin systemProprietary0.0161219.900000.07295
DieDoped siliconSilicon (Si)7440-21-30.41905100.000001.89661
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.44685
Iron (Fe)7439-89-60.237082.320001.07302
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03700
Zinc (Zn)7440-66-60.012260.120000.05550
Gold alloyGold (Au)7440-57-50.003060.029970.01386
Silver (Ag)7440-22-40.002040.019980.00924
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02310
Nickel (Ni)7440-02-00.130671.278720.59142
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49064
FillerSilica -amorphous-7631-86-90.395003.490001.78775
Silica fused60676-86-09.5999384.8200043.44897
PigmentCarbon black1333-86-40.018110.160000.08196
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55323
Epoxy resin systemProprietary0.179961.590000.81448
Phenolic resinProprietary0.254662.250001.15256
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.89532
WirePure metalCopper (Cu)7440-50-80.0556896.550000.25200
Pure metal layerGold (Au)7440-57-50.000200.350000.00091
Palladium (Pd)7440-05-30.001793.100000.00809
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.