Chemical content 74HCT4017D

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Type numberPackagePackage descriptionTotal product weight
74HCT4017DSOT109-1SO16142.33840 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9337152406531112601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.025001.000000.01756
FillerSilver (Ag)7440-22-41.8750075.000001.31728
PolymerAcrylic resinProprietary0.150006.000000.10538
Resin systemProprietary0.4500018.000000.31615
DieDoped siliconSilicon (Si)7440-21-30.41905100.000000.29440
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.61914
Iron (Fe)7439-89-61.704002.400001.19715
Phosphorus (P)7723-14-00.021300.030000.01496
Zinc (Zn)7440-66-60.071000.100000.04988
Mould CompoundFillerSilica -amorphous-7631-86-90.408000.600000.28664
Silica fused60676-86-053.2644078.3300037.42096
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.148006.100002.91418
PigmentCarbon black1333-86-40.136000.200000.09555
PolymerEpoxy resin systemProprietary6.026168.862004.23369
Phenolic resinProprietary4.017445.908002.82246
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00211
Nickel (Ni)7440-02-00.2910097.000000.20444
Palladium (Pd)7440-05-30.006002.000000.00422
WirePure metalCopper (Cu)7440-50-80.11935100.000000.08385
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.