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Chemical content 74HCT4017D

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Type numberPackagePackage descriptionTotal product weight
74HCT4017DSOT109-1SO16142.33840 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337152406531112601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.40686
PolymerResin systemProprietary0.4975019.900000.34952
subTotal2.50000100.000001.75638
DieDoped siliconSilicon (Si)7440-21-30.41905100.000000.29440
subTotal0.41905100.000000.29440
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.61914
Iron (Fe)7439-89-61.704002.400001.19715
Phosphorus (P)7723-14-00.021300.030000.01496
Zinc (Zn)7440-66-60.071000.100000.04988
subTotal71.00000100.0000049.88113
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.24535
FillerSilica fused60676-86-053.7200079.0000037.74105
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.86641
PigmentCarbon black1333-86-40.136000.200000.09555
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.91094
Non hazardousProprietary2.788004.100001.95871
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.95547
subTotal68.00000100.0000047.77348
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00211
Nickel (Ni)7440-02-00.2910097.000000.20444
Palladium (Pd)7440-05-30.006002.000000.00422
subTotal0.30000100.000000.21077
WirePure metalCopper (Cu)7440-50-80.11935100.000000.08385
subTotal0.11935100.000000.08385
total142.33840100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.