Chemical content 74HCT4051BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT4051BQSOT763-1DHVQFN1622.25458 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352774231151512601235Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29154
PolymerResin systemProprietary0.0161219.900000.07243
DieDoped siliconSilicon (Si)7440-21-30.58076100.000002.60964
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.12758
Iron (Fe)7439-89-60.237082.320001.06531
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03673
Zinc (Zn)7440-66-60.012260.120000.05510
Gold alloyGold (Au)7440-57-50.003060.029970.01376
Silver (Ag)7440-22-40.002040.019980.00917
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02294
Nickel (Ni)7440-02-00.130671.278720.58717
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.47994
FillerSilica -amorphous-7631-86-90.395003.490001.77491
Silica fused60676-86-09.5999384.8200043.13686
PigmentCarbon black1333-86-40.018110.160000.08137
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.54926
Epoxy resin systemProprietary0.179961.590000.80863
Phenolic resinProprietary0.254662.250001.14428
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.88171
WirePure metalCopper (Cu)7440-50-80.0538996.550000.24214
Pure metal layerGold (Au)7440-57-50.000200.350000.00088
Palladium (Pd)7440-05-30.001733.100000.00777
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.