Chemical content 74HCT4066D-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4066D-Q100SOT108-1SO14141.78902 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298458118712601235Nijmegen, Netherlands; Bangkok, Thailand; Shanghai, China; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01648
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
DieDoped siliconSilicon (Si)7440-21-30.35253100.000000.24863
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.67541
Iron (Fe)7439-89-61.175702.400000.82919
Phosphorus (P)7723-14-00.014700.030000.01036
Zinc (Zn)7440-66-60.048990.100000.03455
Mould CompoundFillerSilica -amorphous-7631-86-90.546510.600000.38544
Silica fused60676-86-071.3464978.3300050.31877
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.556156.100003.91861
PigmentCarbon black1333-86-40.182170.200000.12848
PolymerEpoxy resin systemProprietary8.071918.862005.69290
Phenolic resinProprietary5.381275.908003.79527
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02631
Nickel (Ni)7440-02-01.1477892.300000.80950
Palladium (Pd)7440-05-30.038553.100000.02719
Silver (Ag)7440-22-40.019901.600000.01403
WirePure metalCopper (Cu)7440-50-80.09104100.000000.06421
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.