Chemical content 74HCT4067BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4067BQ-Q100SOT815-1DHVQFN2451.00595 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935306682118612601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001271.000000.00249
FillerSilver (Ag)7440-22-40.0953975.000000.18702
PolymerAcrylic resinProprietary0.007636.000000.01496
Resin systemProprietary0.0228918.000000.04489
DieDoped siliconSilicon (Si)7440-21-31.19350100.000002.33992
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0780897.4700037.40363
Iron (Fe)7439-89-60.469762.400000.92099
Phosphorus (P)7723-14-00.005870.030000.01151
Zinc (Zn)7440-66-60.019570.100000.03837
Mould CompoundAdditiveNon hazardousProprietary0.858522.910001.68318
FillerSilica -amorphous-7631-86-91.029633.490002.01865
Silica fused60676-86-025.0239484.8200049.06083
PigmentCarbon black1333-86-40.047200.160000.09255
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.318631.080000.62468
Epoxy resin systemProprietary0.469091.590000.91967
Phenolic resinProprietary0.663802.250001.30143
Tetramethylbiphenyl diglycidyl ether85954-11-61.091593.700002.14012
Pre-PlatingPure metal layerGold (Au)7440-57-50.004971.000000.00974
Nickel (Ni)7440-02-00.4521491.000000.88645
Palladium (Pd)7440-05-30.039758.000000.07793
WirePure metalCopper (Cu)7440-50-80.1088296.550000.21335
Pure metal layerGold (Au)7440-57-50.000390.350000.00077
Palladium (Pd)7440-05-30.003493.100000.00685
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.