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Chemical content 74HCT595BQ

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Type numberPackagePackage descriptionTotal product weight
74HCT595BQSOT763-1DHVQFN1622.06511 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352737331151612601235Nijmegen, Netherlands; Suzhou, China; Shanghai, China; Hsin-chu, Taiwan; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29404
PolymerResin systemProprietary0.0161219.900000.07305
subTotal0.08100100.000000.36709
DieDoped siliconSilicon (Si)7440-21-30.38940100.000001.76478
subTotal0.38940100.000001.76478
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.50650
Iron (Fe)7439-89-60.237082.320001.07446
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03705
Zinc (Zn)7440-66-60.012260.120000.05558
Gold alloyGold (Au)7440-57-50.003060.029970.01388
Silver (Ag)7440-22-40.002040.019980.00925
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02313
Nickel (Ni)7440-02-00.130671.278720.59221
subTotal10.21900100.0000046.31288
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49265
FillerSilica -amorphous-7631-86-90.395003.490001.79015
Silica fused60676-86-09.5999384.8200043.50727
PigmentCarbon black1333-86-40.018110.160000.08207
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55397
Epoxy resin systemProprietary0.179961.590000.81557
Phenolic resinProprietary0.254662.250001.15411
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.89787
subTotal11.31800100.0000051.29366
WirePure metalCopper (Cu)7440-50-80.0557296.550000.25251
Pure metal layerGold (Au)7440-57-50.000200.350000.00092
Palladium (Pd)7440-05-30.001793.100000.00811
subTotal0.05771100.000000.26154
total22.06511100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.