×

Chemical content 74HCU04BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCU04BQSOT762-1DHVQFN1418.01559 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352936421151112601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10342
PolymerResin systemProprietary0.0046319.900000.02569
subTotal0.02326100.000000.12911
DieDoped siliconSilicon (Si)7440-21-30.26494100.000001.47064
subTotal0.26494100.000001.47064
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.76158
Iron (Fe)7439-89-60.167512.400000.92980
Phosphorus (P)7723-14-00.002090.030000.01162
Zinc (Zn)7440-66-60.006980.100000.03874
subTotal6.97956100.0000038.74174
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.69926
FillerSilica -amorphous-7631-86-90.367153.490002.03795
Silica fused60676-86-08.9230684.8200049.52968
PigmentCarbon black1333-86-40.016830.160000.09343
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63065
Epoxy resin systemProprietary0.167271.590000.92846
Phenolic resinProprietary0.236702.250001.31386
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.16057
subTotal10.52000100.0000058.39386
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00983
Nickel (Ni)7440-02-00.1612391.000000.89495
Palladium (Pd)7440-05-30.014178.000000.07868
subTotal0.17718100.000000.98346
WirePure metalCopper (Cu)7440-50-80.0489196.550000.27149
Pure metal layerGold (Au)7440-57-50.000180.350000.00098
Palladium (Pd)7440-05-30.001573.100000.00872
subTotal0.05066100.000000.28119
total18.01559100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.