Chemical content 74HCU04PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCU04PW-Q100SOT402-1TSSOP1459.72992 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300231118912601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02608
PolymerAcrylic resinProprietary0.0030415.200000.00509
Resin systemProprietary0.001386.900000.00231
DieDoped siliconSilicon (Si)7440-21-30.26494100.000000.44357
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.44307
Iron (Fe)7439-89-60.462442.400000.77422
Phosphorus (P)7723-14-00.005780.030000.00968
Zinc (Zn)7440-66-60.019270.100000.03226
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39779
Silica fused60676-86-031.0186878.3300051.93156
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.04420
PigmentCarbon black1333-86-40.079200.200000.13260
PolymerEpoxy resin systemProprietary3.509358.862005.87537
Phenolic resinProprietary2.339575.908003.91691
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02457
Nickel (Ni)7440-02-00.4514692.300000.75583
Palladium (Pd)7440-05-30.015163.100000.02539
Silver (Ag)7440-22-40.007831.600000.01310
WirePure metalCopper (Cu)7440-50-80.08745100.000000.14640
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.