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Chemical content 74LV1T04GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV1T04GW-Q100SOT353-1UMT55.66385 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691109125412601235Nijmegen, Netherlands; Seremban, Malaysia; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.12871
PolymerResin systemProprietary0.0024325.000000.04290
subTotal0.00972100.000000.17161
DieDoped siliconSilicon (Si)7440-21-30.07216100.000001.27396
subTotal0.07216100.000001.27396
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400033.68288
Iron (Fe)7439-89-60.045512.310000.80346
Lead (Pb)7439-92-10.000200.010000.00348
Phosphorus (P)7723-14-00.001380.070000.02435
Zinc (Zn)7440-66-60.002360.120000.04174
Pure metal layerSilver (Ag)7440-22-40.012800.650000.22608
subTotal1.97000100.0000034.78199
Mould CompoundFillerSilica -amorphous-7631-86-90.4606014.000008.13228
Silica fused60676-86-02.3217570.5700040.99249
PigmentCarbon black1333-86-40.006580.200000.11618
PolymerEpoxy resin systemProprietary0.305649.290005.39635
Phenolic resinProprietary0.195435.940003.45041
subTotal3.29000100.0000058.08771
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00016
Bismuth (Bi)7440-69-90.000000.001000.00005
Copper (Cu)7440-50-80.000000.001000.00005
Lead (Pb)7439-92-10.000020.005000.00027
Tin solderTin (Sn)7440-31-50.3099799.990005.47276
subTotal0.31000100.000005.47329
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0119799.990000.21142
subTotal0.01198100.000000.21144
total5.66385100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.