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Chemical content 74LV1T86GX

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Type numberPackagePackage descriptionTotal product weight
74LV1T86GXSOT1226-3X2SON50.61376 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690206125712601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02706100.000004.40861
subTotal0.02706100.000004.40861
ComponentAdditiveNon hazardousProprietary0.000205.000000.03259
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03259
Silica -amorphous-7631-86-90.0020050.000000.32586
PolymerEpoxy resin systemProprietary0.0012030.000000.19552
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06517
subTotal0.00400100.000000.65173
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100038.95827
Magnesium (Mg)7439-95-40.000380.150000.06183
Nickel (Ni)7440-02-00.007462.950001.21603
Silicon (Si)7440-21-30.001620.640000.26382
Pure metal layerGold (Au)7440-57-50.000050.020000.00824
Nickel (Ni)7440-02-00.004151.640000.67603
Palladium (Pd)7440-05-30.000230.090000.03710
subTotal0.25300100.0000041.22132
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.20842
FillerSilica -amorphous-7631-86-90.000900.290000.14742
Silica fused60676-86-00.2687986.1500043.79367
HardenerPhenolic resinProprietary0.013384.290002.18079
PigmentCarbon black1333-86-40.000590.190000.09658
PolymerEpoxy resin systemProprietary0.027058.670004.40733
subTotal0.31200100.0000050.83421
WireGold alloyGold (Au)7440-57-50.0175399.000002.85583
Palladium (Pd)7440-05-30.000181.000000.02885
subTotal0.01770100.000002.88468
total0.61376100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.