Chemical content 74LV4051PW

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Type numberPackagePackage descriptionTotal product weight
74LV4051PWSOT403-1TSSOP1664.11375 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93519100011811126030 s123520 s3Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.4005080.100000.62467
PolymerResin systemProprietary0.0995019.900000.15519
DieDoped siliconSilicon (Si)7440-21-31.01823100.000001.58816
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-837.0386097.4700057.77014
Iron (Fe)7439-89-60.912002.400001.42247
Phosphorus (P)7723-14-00.011400.030000.01778
Zinc (Zn)7440-66-60.038000.100000.05927
Mould CompoundAdditiveNon hazardousProprietary1.081004.700001.68607
FillerSilica fused60676-86-018.1700079.0000028.34025
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.380006.000002.15242
PigmentCarbon black1333-86-40.046000.200000.07175
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.920004.000001.43495
Non hazardousProprietary0.943004.100001.47082
Tetramethylbiphenyl diglycidyl ether85954-11-60.460002.000000.71747
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.02340
Nickel (Ni)7440-02-01.4550097.000002.26940
Palladium (Pd)7440-05-30.030002.000000.04679
WirePure metalCopper (Cu)7440-50-80.09552100.000000.14899
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.