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Chemical content 74LVC00ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC00ABQ-Q100SOT762-1DHVQFN1418.11242 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300352115412601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10286
PolymerResin systemProprietary0.0046319.900000.02556
subTotal0.02326100.000000.12842
DieDoped siliconSilicon (Si)7440-21-30.13448100.000000.74245
subTotal0.13448100.000000.74245
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.7447197.4700037.23804
Iron (Fe)7439-89-60.166072.400000.91691
Phosphorus (P)7723-14-00.002080.030000.01146
Zinc (Zn)7440-66-60.006920.100000.03820
subTotal6.91978100.0000038.20461
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.69018
FillerSilica -amorphous-7631-86-90.367153.490002.02705
Silica fused60676-86-08.9230784.8200049.26494
PigmentCarbon black1333-86-40.016830.160000.09293
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62728
Epoxy resin systemProprietary0.167271.590000.92350
Phenolic resinProprietary0.236702.250001.30684
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.14902
subTotal10.52001100.0000058.08174
Pre-PlatingPure metal layerGold (Au)7440-57-50.013843.000000.07642
Nickel (Ni)7440-02-00.4258792.300002.35127
Palladium (Pd)7440-05-30.014303.100000.07897
Silver (Ag)7440-22-40.007381.600000.04076
subTotal0.46140100.000002.54742
WirePure metalCopper (Cu)7440-50-80.0516596.550000.28515
Pure metal layerGold (Au)7440-57-50.000190.350000.00103
Palladium (Pd)7440-05-30.001663.100000.00916
subTotal0.05349100.000000.29534
total18.11242100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.