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Chemical content 74LVC08ABQ

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Type numberPackagePackage descriptionTotal product weight
74LVC08ABQSOT762-1DHVQFN1421.75205 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352735451152512601235Hsin-chu, Taiwan; Suzhou, China; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43452
PolymerResin systemProprietary0.0234819.900000.10795
subTotal0.11800100.000000.54247
DieDoped siliconSilicon (Si)7440-21-30.13309100.000000.61185
subTotal0.13309100.000000.61185
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.73971
Iron (Fe)7439-89-60.205522.346100.94482
Phosphorus (P)7723-14-00.002650.030200.01216
Zinc (Zn)7440-66-60.008890.101500.04088
Pure metal layerGold (Au)7440-57-50.002650.030200.01216
Nickel (Ni)7440-02-00.106921.220500.49152
Palladium (Pd)7440-05-30.004910.056000.02255
Silver (Ag)7440-22-40.001800.020500.00826
subTotal8.76000100.0000040.27206
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69714
FillerSilica -amorphous-7631-86-90.442743.490002.03540
Silica fused60676-86-010.7602784.8200049.46782
PigmentCarbon black1333-86-40.020300.160000.09331
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62987
Epoxy resin systemProprietary0.201711.590000.92730
Phenolic resinProprietary0.285442.250001.31222
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15787
subTotal12.68600100.0000058.32093
WirePure metalCopper (Cu)7440-50-80.0530796.550000.24397
Pure metal layerGold (Au)7440-57-50.000190.350000.00088
Palladium (Pd)7440-05-30.001703.100000.00783
subTotal0.05496100.000000.25268
total21.75205100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.